Consultans£º
Yang Qiang (Webank/The Hong Kong University of Science and Technology, Shenzhen , China, Academician of the Academy of Science of the Royal Society of Canada, Fellow of Canadian Academy of Engineering)
Wu Qidi£¨Tongji University, Shanghai, China£©
Wu Zhaohui(Zhejiang University, Hangzhou, China, Academician of Chinese Academy of Sciences)
Harry Shum£¨Tsinghua University, Beijing, China, Foreign Academician of the National Academy of Engineering,
International Fellow of the Royal Academy of Engineering£©
Zhang Xu£¨Shanghai Branch of Chinese Academy of Science, Shanghai, China, Academician of Chinese Academy of Sciences£©
Zhang Qin£¨China Association for Science and Technology/Tsinghua University, Beijing, China, Academician of International Nuclear Energy Academy£©
Zheng Nanning£¨Xi¡¯an Jiaotong University, Xi¡¯an, China, Academician of Chinese Academy of Engineering£©
Yao Yu£¨Harbin Engineering University, Harbin, China£©
Zhao Qinping£¨Science & Technology Commission of Ministry of Education/Beihang University, Beijing, China, Academician of Chinese Academy of Engineering£©
Gao Wen£¨Peking University, Beijing, China, Academician of Chinese Academy of Engineering£©
Han Duanfeng£¨Harbin Engineering University, Harbin, China£©

Editor-in-Chief£º
Li Deyi£¨Academy of Military Sciences, Beijing, China, Academician of Chinese Academy of Engineering£©

Vice Editor-in-Chief£º
Zhang Jun£¨Beijing Institute of Technology, Beijing, China, Academician of Chinese Academy of Engineering£©
Chen Jie£¨Tongji University, shanghai, China, Academician of Chinese Academy of Engineering£©
Xu Zongben£¨Xi¡¯an Jiaotong University, Xi¡¯an, China, Academician of Chinese Academy of Sciences£©
Guo Yike£¨The Hong Kong University of Science and Technology £¬Hong Kong, China£©
Tang Jie£¨Tsinghua University, Beijing, China£©
Jiao Licheng£¨Xidian University, Xi¡¯an, China, Foreign Academician of Academia Europaea, Foreign Academician of the Russian Academy of Natural Sciences£©
Dai Qionghai£¨Tsinghua University, Beijing, China, Academician of Chinese Academy of Engineering£©

Area Editor£º
Ma Shaoping£¨Tsinghua University, Beijing, China£©
Wang Guoyin£¨Chongqing University of Posts and Telecommunications, Chongqing, China£©
Wang Kejun£¨Harbin Engineering University,Harbin, China£©
Fang Yongchun£¨Nankai University, Tianjin, China£©
Zhu Xiaoyan£¨Tsinghua University, Beijing, China£©
Liu Hong£¨Peking University, Beijing, China£©
Sun Maosong£¨Tsinghua University, Beijing, China, Foreign Academician of Academia Europaea£©
Sun Fuchun£¨Tsinghua University, Beijing, China£©
Miao Duoqian£¨Tongji University, Shanghai, China£©
Zhou Zhihua£¨Nanjing University, Nanjing, China, Foreign Academician of Academia Europaea£©
Duan Haibin£¨Beihang University, Beijing, China£©
Xu Bo£¨Institute of Automation,Chinese Academy of Sciences, Beijing, China£©
Huang Tiejun£¨Peking University, Beijing, China£©
Jiang Tianzi£¨Institute of Automation,Chinese Academy of Sciences, Beijing, China, Foreign Academician of Academia Europaea£©

Members:
Yu Jian£¨Beijing Jiaotong University, Beijing, China£©
Ma Shilong£¨Beihang University, Beijing, China£©
Ma Nan£¨Beijing Union University, Beijing, China£©
Wang Xiaojie£¨Beijing University of Posts and Telecommunications, Beijing, China£©
Wang Feiyue£¨Institute of Automation,Chinese Academy of Sciences, Beijing, China£©
Wang Long£¨Peking University, Beijing, China£©
Wang Tianmiao£¨Beihang University, Beijing, China£©
Wang Liquan£¨Harbin Engineering University,Harbin, China£©
Wang Zhiliang£¨University of Science and Technology Beijing, Beijing, China£©
Wang Hongguang£¨Shenyang Institute of Automation Chinese Academy, China£©
Wang Pu£¨Beijing University of Technology, Beijing, China£©
Wang Xizhao£¨Shenzhen University, Shenzhen, China£©
Wang Yunhong£¨Beihang University, Beijing, China£©
Wang Yaonan£¨Hunan University, Changsha, China, Academician of Chinese Academy of Engineering£©
Yin Yilong£¨Shandong University, Ji¡¯nan, China£©
Yin Yixin£¨University of Science and Technology Beijing, Beijing, China£©
Tian Jinwen£¨Huazhong University of Science and Technology, Wuhan, China£©
Piao Songhao£¨Harbin Institute of Technology,Harbin, China£©
Bi Xiaojun£¨Minzu University of China, Beijing, China£©
Zhu Qidan£¨Harbin Engineering University, Harbin, China£©
Qiao Junfei£¨Beijing University of Technology, Beijing, China£©
Ren Fuji£¨University of Electronic Science and Technology of China, Chengdu, China£©
Liu Ding£¨Xi¡¯an University of Technology, Xi¡¯an, China£©
Liu Qing£¨Wuhan University of Technology, Wuhan, China£©
Liu Zengliang£¨China People¡®s Liberation Army National Defence University, Beijing, China£©
Ruan Qiuqi£¨Beijing Jiaotong University, Beijing, China£©
Yan Zheping£¨Harbin Engineering University, Harbin, China£©
Su Yumin£¨Harbin Engineering University, Harbin, China£©
Du Junping£¨Beijing University of Posts and Telecommunications, Beijing, China£©
Li Juanzi£¨Tsinghua University, Beijing, China£©
Li Xuelian£¨Editorial Department of CAAI Transactions on Intelligent Systems, Harbin, China£©
Li Bin£¨Huazhong University of Science and Technology, Beijing, China£©
Yang Chunyan£¨Guangdong University of Technology, Guangzhou, China£©
Wu Fei£¨Zhejiang University, Hangzhou, China£©
Wu Gansha£¨UISEE Technology (Beijing) Co., Ltd., Beijing, China£©
Wu Zhiwei£¨Zhejiang Ocean University, Zhoushan, China£©
Wu Xindong£¨Mininglamp Technology, Beijing, China£©
He Qing£¨Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China£©
He Wen£¨Academy of Military Sciences, Beijing, China£©
Wang Lei£¨Tongji University, Shanghai, China£©
Zhang Rubo£¨Dalian Minzu University, Dalian, China£©
Zhang Xuegong£¨Tsinghua University, Beijing, China£©
Zhang Mingjun£¨Harbin Engineering University, Harbin, China£©
Zhang Minling£¨Southeast University, Nanjing, China£©
Chen Xiaoping£¨University of Science and Technology of China, Hefei, China£©
Chen Songcan£¨Nanjing University of Aeronautics and Astronautics, Nanjing, China£©
Chen Enhong£¨University of Science and Technology of China, Hefei, China£©
Chen Zengqiang£¨Nankai University, Tianjin, China£©
Feng Jufu£¨Peking University, Beijing, China£©
Zhao Yuxin£¨Harbin Engineering University, Harbin, China£©
Zhao Keqin£¨Institute of Zhuji Connection Mathematics, Zhuji, China£©
Zhao Chunjiang£¨National Engineering Research Center for Information Technology in Agriculture, Beijing, Academician of Chinese Academy of Engineering£©
Zhao Chunhui£¨Harbin Engineering University, Harbin, China£©
Hu Qinghua£¨Tianjin University, Tianjin, China£©
Jiang Feng£¨Harbin Institute of Technology, Harbin, China£©
Ban Xiaojuan£¨University of Science and Technology Beijing, Beijing, China£©
Jia Yingmin£¨Beihang University, Beijing, China£©
Xia Guihua£¨Harbin Engineering University, Harbin, China£©
Xu Ruobing£¨HEU Journal Press, Harbin, China£©
Gao Yang£¨Nanjing University, Nanjing, China£©
Guo Maozu£¨Beijing University Of Civil Engineering And Architecture, Beijing, China£©
Huang Xinhan£¨Huazhong University of Science and Technology, Wuhan, China£©
Huang Heyan£¨Beijing Institute Of Technology, Beijing, China£©
Zhang Yi£¨Sichuan University, Chengdu, China£©
Liang Jiye£¨Shanxi University, Taiyuan, China£©
Jiang Changjun£¨Tongji University, Shanghai, China, Academician of Chinese Academy of Engineering£©
Lu Huaxiang£¨Institute of Semiconductors,Chinese Academy of Sciences, Beijing, China£©
Tan Ying£¨Peking University, Beijing, China£©

Associate Board Member£º
Wang Weiping£¨University of Science and Technology Beijing, Beijing, China£©
Wang Dong£¨Dalian University of Technology,Dalian, China£©
Wang Jun£¨China University of Mining and Technology, China£©
Wang Mingming£¨Northwestern Polytechnical University, Xi¡¯an China£©
Wang Hui£¨Harbin Engineering University, Harbin, China£©
Wang Lei£¨Beijing Information Science and Technology University, Beijing, China£©
Shi Lei£¨Communication University of China, Beijing, China£©
Ning Xin£¨Institute of Semiconductors,Chinese Academy of Sciences, Beijing, China£©
Xing Xianglei£¨Harbin Engineering University, Harbin, China£©
Zhu Fang£¨Zhongxing Telecom Equipment, China£©
Wu Xiru£¨Guilin University Of Electronic Technology, Guilin, China£©
Liu Jinping£¨Hunan Normal University, Hunan, China£©
Liu Dun£¨Southwest Jiaotong University, Chengdu, China£©
Liu Hui£¨Central South University, Changsha, China£©
Yi Peng£¨Tongji University, Shanghai, China£©
Sun Ning£¨Nankai University, Tianjin, China£©
Li Wenling£¨Beihang University, Beijing, China£©
Li Jiahong£¨Beijing Union University, Beijing, China£©
Zhang Yuanpeng£¨Nantong University ,Nantong, China/ The Hong Kong Polytechnic University, Hong Kong, China£©
Zhang Hui£¨Hunan University, Changsha, China£©
Chen Shanxiong£¨Southwest University, Chongqing, China£©

International Members:
Yuchu Tian, Queensland University of Technology, Australia
Shuzhi Sam Ge, National University of Singapore, Singapore
Benmei Chen, National University of Singapore, Singapore
Mengjie Zhang, Victoria University of Wellington, New Zealand
Yang Shi, University of Victoria, Canada
Xuemin Lin, The University of New South Wales, Australia
Yanchun Zhang,Victoria University, Australia
Radu-Emil Precup, Politehnica University of Timisoara, Romania
Sergey Ablameyko, Belarusian State University, Belarus
Youmin Zhang, Concordia University, Canada
Otto Heinrich Herzog, Tongji University, Germany