[1]YANG Dong-sheng,KANG Qi,LIU Bo,et al.Swarm intelligence analysis of primary and secondary causes of defective products for manufacturing system[J].CAAI Transactions on Intelligent Systems,2009,4(6):502-507.[doi:10.3969/j.issn.1673-4785.2009.06.006]
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CAAI Transactions on Intelligent Systems[ISSN 1673-4785/CN 23-1538/TP] Volume:
4
Number of periods:
2009 6
Page number:
502-507
Column:
学术论文—智能系统
Public date:
2009-12-25
- Title:
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Swarm intelligence analysis of primary and secondary causes of defective products for manufacturing system
- Author(s):
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YANG Dong-sheng1; 3; KANG Qi1; 2; LIU Bo1; WANG Lei1; 2; WU Qi-di1; 2
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1. College of Electronics and Information Engineering, Tongji University, Shanghai 201804, China; 2. Key Laboratory of Embedded System and Computerservice of Ministry of Education, Tongji University, Shanghai 201804, China; 3. Shanghai Economic and Information Committee, Shanghai 200040, China
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- Keywords:
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swarm intelligence; semiconductor manufacturing; primary and secondary causes; intelligent analysis
- CLC:
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TP18
- DOI:
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10.3969/j.issn.1673-4785.2009.06.006
- Abstract:
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Understanding and reducing both primary and secondary causes of defective products is an important part of quality control in semiconductor manufacturing. By applying a swarm intelligence optimization concept to the bump reflow process, the authors were able to formulate a novel analytical method for analyzing the primary and secondary causes of defective products. Their method used swarm heuristic information to reduce computational complexity when processing large amounts of production data. Numerical simulations based on actual production data were performed to verify the proposed method. The results showed its validity.